APPLIED MATERIALS SOUTH EAST ASIA PTE. LTD.
Last updated: Oct 2026
Overview
Status
Live Company
On the ACRA register
Company age
31 years
Since 30 Sep 1995
Entity type
Local Company
Private Company Limited by Shares
Company address
8 Upper Changi Road North, Applied Materials Building
Singapore 506906
APPLIED MATERIALS SOUTH EAST ASIA PTE. LTD. (UEN 199507015D) is a live private company limited by shares in Singapore. It was registered on 30 September 1995 and has operated for 31 years. Its primary (principal) activity is manufacture/repair of semiconductor foundry equipment (SSIC 28274), and its secondary activity is manufacture/repair of other special purpose machinery n.e.c. (SSIC 28299). Since 2023 it has won 6 government contracts from 1 public agency. Its registered address is 8 Upper Changi Road North, Applied Materials Building, Singapore 506906.
Profile
Company information
- Legal name
- APPLIED MATERIALS SOUTH EAST ASIA PTE. LTD.
- UEN
- 199507015D
- Status
- Live Company
- Entity type
- Local Company
- Company type
- Private Company Limited by Shares
- Incorporated
- 30 Sep 1995 (31 years ago)
- Annual return
- 10 Jul 2026
- Accounts due
- 25 May 2027
- Officers
- 22
Address and contact
- Registered address
- 8 UPPER CHANGI ROAD NORTH, APPLIED MATERIALS BUILDING, Singapore 506906
- Area
- Changi West, Changi (East Region)
- Postal district
- D17 (Loyang, Changi)
Website and social
Business activity
- Primary activity
- 28274 Manufacture/repair of semiconductor foundry equipment
- Secondary activity
- 28299 Manufacture/repair of other special purpose machinery n.e.c.
Government
Contracts
APPLIED MATERIALS SOUTH EAST ASIA PTE. LTD. won 6 government contracts from 1 public agency through GeBIZ since April 2020. The total award value is S$34,660,012.
| Tender | Awarded | Amount |
|---|---|---|
| Provision of One (1) Unit of Fully Automated Die-to-Wafer Surface Preparation Equipment and/or Die-to-Wafer BonderNST000ETT25000033Agency for Science, Technology and Research | 4 Mar 2026 | S$4,922,225 |
| Provision of One (1) or More Units of Physical Vapor Deposition (PVD) Cluster tool(s) for Through Silicon Via (TSV) barriers-seed layers, Redistribution Layer (RDL) barrier-seed layers and Back-End of Line (BEOL) metallization on 300mm wafers.NST000ETT25000064Agency for Science, Technology and Research | 27 Nov 2025 | S$13,112,722 |
| Provision of one (1) Unit of Fully automated 12" Chemical - Mechanical Planarization (CMP) System with Integrated Cleaning Module.NST000ETT25000065Agency for Science, Technology and Research | 10 Nov 2025 | S$4,871,420 |
| Provision of One (1) unit of Critical Dimension Scanning Electron Microscope (CDSEM) SystemNST000ETT24000075Agency for Science, Technology and Research | 6 Jan 2025 | S$4,205,645 |
| Provision of one (1) unit of Critical Dimension Scanning Electron Microscope (CDSEM) SystemNST000ETT23000068Agency for Science, Technology and Research | 20 Dec 2023 | S$3,400,500 |