SSIC Sub-class 28273 – Manufacture/repair of semiconductor assembly and testing equipment

Companies in this sub-class make, repair or maintain machinery that assembles, packages or tests semiconductors, such as burn-in systems.

Probe cards and bonding tools are classified elsewhere.

Companies in Manufacture/repair of semiconductor assembly and testing equipment4 companies

Company Status Registered Area
AXIS-TEC PTE. LTD. 200401214N Live Company 4 Feb 2004 4 Feb 2004 Serangoon
NEUTRON TECHNOLOGY ENTERPRISE PTE. LTD. 201103559K Live Company 12 Feb 2011 12 Feb 2011 Geylang
NEWPORT OPTO-ELECTRONICS TECHNOLOGIES (SINGAPORE) PTE. LTD. 200301255M Live Company 13 Feb 2003 13 Feb 2003 Bedok
PENG CHENG AUTOTECH PTE. LTD. 200607808W Live Company 31 May 2006 31 May 2006 Bukit Merah

View the 4 companies with this as their secondary activity

Other sub-classes in Class 2827

CodeTitleCompanies
28271 Manufacture of probe cards 0
28272 Manufacture of bonding tools 0
28274 Semiconductor foundry equipment 4
Useful information for businesses in this sub-class
  • Premises that count as a factory must be notified to or registered with MOM. (MOM)
  • Discharging trade effluent into a watercourse or onto land needs written NEA permission. (NEA)